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Furnace
Systems
(Custom)
General Air
has experienced and manufactured many furnace applications,
used in the semiconductor or optoelectronic industries, in different
configurations and for many applications of processing wafers,
systems for the purpose of diffusion, oxidation, CVD, and LPCVD,
in addition to LPE systems, for different size wafers from 1"
dia. to 6" dia.
In different size reactors, and in different number of reactor
tubes, with accordance to customer needs.
All manufacturing
and engineering work is conducted with accordance to national
safety standards, and with accordance to the semiconductor
industry practices.
All material and workmanship are provided under the company
warranty standards.
Custom
certification for CE. UL and other standards are also available
with accordance to customer specifications.
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Specifications
| Reactor |
1"
to 8" dia. quartz tube. |
| System
Orientation |
Horizontal
tube 1 to 4 tubes, or Vertical bell-jar. |
| Enclosure |
Constructed
of 16ga. Cr. Steel with baked enamel paint finish, Stainless
Steel option also available. |
| Temp.
Control |
3
Zone System, ambient to 1200 degrees C |
| Temp.
Stability |
400
to 1100 degree C @ +/- 0.25 C |
| Leak
Rate |
1
X 10 -9cc/min, atm. of helium (for low pressure systems.) |
| Control
System |
PLC
furnace & function control with PID algorithm. |
| Alarm |
Dedicated
automatic temperature and toxic or flamable system. With EMO
as secondary. |
| Power |
208-220
volt single or 3 phase system, OR 480 volt 3 phase |
| Vent |
Natural
convection or forced air system. |
| Custom
Option |
Additional
options available, consult factory. |
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